Heat Gun

  • QUICK TR1300A 1300W lead free Hot Air Rework Station
  • [content:title]
  • [content:title]
  • [content:title]

QUICK TR1300A 1300W lead free Hot Air Rework Station

  • Availibility: In Stock
  • Certification: ISO9001/SGS/PSE/ROSH/EMC/FCC/PATENT
  • Payments:
  • Categories : Hot Air Station,

We are a Chinese tool manufacturer, which has various certifications around the world, providing free customization of your LOGO, small batch samples, and free global delivery to your home. If necessary, please Contact us by email or Whatapp, thank you

applications• Suitable for reworking various components, such as SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA and QFN• Application: Heat shrinkage, drying, paint removal, defrostation, preheating, sterilizing, adhesive soldering etc.• Air volume adjustable, suitable for small and large air volume heating

applications

• Suitable for reworking various components, such as SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA and QFN
• Application: Heat shrinkage, drying, paint removal, defrostation, preheating, sterilizing, adhesive soldering etc.
• Air volume adjustable, suitable for small and large air volume heating occasions.
• Suitable for lead-free hot air reworking occasion.

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diy hot air rework stationdiy hot air rework stationdiy hot air rework station



diy hot air rework stationdiy hot air rework stationdiy hot air rework station



diy hot air rework stationdiy hot air rework stationdiy hot air rework station



diy hot air rework stationdiy hot air rework stationdiy hot air rework station



diy hot air rework stationdiy hot air rework stationdiy hot air rework station




Voltage:110V/220V AC
Model Number:TR1300A
Type:
DigitalTemperature Control Accuracy:
Temperature range:100- 500 ℃
Air volume:6-70 L/Min
Outer dimensions:215* 230 * 155 (mm)
Weight:About 5 kg
Power:1300W


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applications• Suitable for reworking various components, such as SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA and QFN• Application: Heat shrinkage, drying, paint removal, defrostation, preheating, sterilizing, adhesive soldering etc.• Air volume adjustable, suitable for small and large air volume heating applications• Suitable for reworking various components, such as SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA and QFN• Application: Heat shrinkage, drying, paint removal, defrostation, preheating, sterilizing, adhesive soldering etc.• Air volume adjustable, suitable for small and large air volume heating applications• Suitable for reworking various components, such as SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA and QFN• Application: Heat shrinkage, drying, paint removal, defrostation, preheating, sterilizing, adhesive soldering etc.• Air volume adjustable, suitable for small and large air volume heating applications• Suitable for reworking various components, such as SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA and QFN• Application: Heat shrinkage, drying, paint removal, defrostation, preheating, sterilizing, adhesive soldering etc.• Air volume adjustable, suitable for small and large air volume heating applications• Suitable for reworking various components, such as SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA and QFN• Application: Heat shrinkage, drying, paint removal, defrostation, preheating, sterilizing, adhesive soldering etc.• Air volume adjustable, suitable for small and large air volume heating applications• Suitable for reworking various components, such as SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA and QFN• Application: Heat shrinkage, drying, paint removal, defrostation, preheating, sterilizing, adhesive soldering etc.• Air volume adjustable, suitable for small and large air volume heating tools-oem

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